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Skylake (microarchitecture)
Skylake is the codename used by Intel for a processor microarchitecture under development and due to launch in 2015 as the successor to the Broadwell microarchitecture.Skylake is a microarchitecture redesign using an already existing process technology, serving as a "tock" in the Intel's "tick-tock" manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake will use the same 14 nm manufacturing process as Broadwell despite the expectancy of the manufacturing process' transition to 10 nm in 2017 following the Skylake's "tick" step in the tick-tock release cycle; the codename for this 10 nm die shrink is Cannonlake.
Features
Like its predecessor, Broadwell, Skylake is expected to become initially available in four variants, identified by the suffixes "S" (SKL-S), "H" (SKL-H), "U" (SKL-U), and "Y" (SKL-Y). An overclockable "K" variant with unlocked multipliers is expected to launch at the same time. The H, U and Y variants will be manufactured in ball grid array (BGA) packaging, while the S variant will be manufactured in land grid array (LGA) packaging using a new socket, LGA 1151. Skylake will be used in conjunction with Intel 100 Series chipsets, also known as Sunrise Point.
Architecture
- 14 nm manufacturing process
- LGA 1151 socket
- Z170/H170 chipset (Sunrise Point)
- Thermal design power (TDP) up to 95 W (LGA 1151)
- Support for both DDR3 SDRAM and DDR4 SDRAM in mainstream variants, using custom UniDIMM SO-DIMM form factor with up to 64 GB of RAM on LGA 1151 variants.
